Company Market Research Report: AEMtec GmbH

Company Overview

• Name:

• AEMtec GmbH

• Mission of the Company:

• AEMtec is committed to innovation and expertise in opto-electronic microtechnology. The company strives to provide reliable and advanced solutions from development to mass production in the field of electronic miniaturization.

• Founded:

• No information is available.

• Founders:

• No information is available.

• Key People in the Company:

• Ingolf Schlosser, Head of Engineering, AEMtec USA

• Headquarters:

• Berlin-Adlershof, Germany

• Number of Employees:

• No information is available.

• Revenue:

• No information is available.

• Company Recognition:

• AEMtec is recognized for its specialization in developing, industrializing, and manufacturing complex micro- and optoelectronic modules into complete systems, with a broad technology portfolio including wafer back-end services, chip on board, and opto packaging.

Products

• Product Offerings:

• Complex micro- and optoelectronic modules

• Customized solutions tailored to specific client requirements across various industries

• Product Description:

• AEMtec develops tailor-made high-end electronic modules leveraging micro- and optoelectronic capabilities, offering reliability and efficiency across different applications.

• Key Features:

• Wafer Back-End Services, Chip on Board, Flip Chip, 3D Integration, Opto Packaging

• Industry applications including medical technology, data and telecommunications, industrial automation, semiconductors, automotive transport, and aerospace.

Recent Developments

• New Product Launches:

• No specific new products launched mentioned.

• Recent Features and Enhancements:

• Implementation of new Electroless Under Bump Metallization (UBM) equipment in-house, offering reduced lead times and enhanced quality across processing services.

• New Partnerships:

• Continued cooperation with Fraunhofer IZM to further develop electroless UBM processes and engage in chiplet technology advancements.

• Notable Company Events:

• The addition of Ingolf Schlosser in AEMtec USA as the Head of Engineering to lead and support innovative projects and expedite customer solutions in the US Tech Center.

Services

• Service Offerings:

• Design, Development, Industrialization, Qualification, Prototyping (NPI), Test and Test System Development, Series Production, Supply Chain Management, and After Sales Services.

• Industry Applications:

• AEMtec caters to demands across several sectors, providing micro- and optoelectronic solutions for medicine (e.g., imaging systems), telecommunications (e.g., optical transceivers), industry automation (e.g., sensors and actuators), and more.

Technologies

• Technology Portfolio:

• Wafer Back-End Services, Opto-Packaging, Chip & Wire Bonding, Flip Chip, SMT - Surface Mount Technology, System Integration

• Focus on miniaturization, high precision integration, and leveraging advanced assembly and packaging solutions.

Markets

• Primary Markets Served:

• Medical Technology, Data & Telecommunications, Industrial & Automation, Semiconductors, Automotive & Transport, Aerospace

• Application Examples:

• Medical: Wearables, endoscopes

• Telecommunications: Routers, access points

• Industrial: Pressure sensors, MEMS systems

• Semiconductors: MOEMS, lithography systems

• Automotive: Driver assistance systems, sensor technology

• Aerospace: Satellite technology, precision components

(Note: Some sections above contain "No information is available" due to the lack of specific data provided on those aspects.)