Clas-SiC Wafer Fab Ltd: Company Profile

Background

Founded in 2017, Clas-SiC Wafer Fab Ltd is the world's first dedicated open foundry specializing in the manufacture of silicon carbide (SiC) power semiconductors. Operating from a custom-built ISO Class 5 cleanroom facility in Lochgelly, Fife, Scotland, the company utilizes state-of-the-art 150mm semiconductor manufacturing equipment. Clas-SiC's mission is to drive innovation in the semiconductor power industry by providing accelerated research and development (R&D) and reducing time-to-market for new device designs. The company's vision is to be a key enabler in the development of smaller, lighter, and more energy-efficient power systems, contributing significantly to the global push for efficient energy conversion across various industries, including automotive, rail, wind, photovoltaic (PV), and aviation.

Key Strategic Focus

Clas-SiC focuses on providing rapid prototyping and low to medium-scale SiC production capacity, delivering a time-to-market advantage for its customers. The company supports customer R&D with over 200 man-years of silicon carbide processing expertise and has developed a library of "off-the-shelf" Process Module Intellectual Property (IP) to minimize technical risk and optimize both R&D cycles and manufacturability. Clas-SiC's toolset is fully capable of processing 150mm SiC wafers through Junction Barrier Schottky (JBS)/Merged PiN Schottky (MPS) diode and Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) flows. The company also offers process module solutions and individual process capabilities, including alignment targets, implant hard masks, carbon cap implant anneal, MOSFET gate dielectric and gate polysilicon, backside ohmic contact, and more.

Financials and Funding

In late 2024, Clas-SiC secured a £12 million equity investment from Archean Chemical Industries (ACIL) of Chennai, India. This investment is intended to enhance the company's technology development and manufacturing capabilities. In return for the investment, ACIL gained representation on Clas-SiC's board of directors, with Ranjit Pendurthi appointed as a director. The funds are being utilized to secure next-generation technology development and manufacturing, with a focus on capital equipment to upskill staff and advance process services and devices.

Pipeline Development

Clas-SiC offers reliability-proven SiC Process Design Kits (PDKs) for various applications, including:

1200V MOSFET PDK

1700V MOSFET PDK

3300V MOSFET PDK

JBS/MPS Diode Design Kit

These PDKs are designed to support customers through development, seeding samples, up to medium volume production, after which Clas-SiC facilitates transfer to high-volume foundry partners.

Technological Platform and Innovation

Clas-SiC's technological platform is distinguished by its proprietary Process Module IP, which includes:

Alignment targets

Implant hard masks

Carbon cap implant anneal

MOSFET gate dielectric and gate polysilicon

Backside ohmic contact

Frontside n+ and p+ ohmic contacts

Schottky contact

MOSFET gate and source contacts

Power metal

Passivation

Backside tri-metal

Wafer test

Prototype reliability of packaged parts

Thinned wafer backside ohmic contact

These modules are designed to minimize technical risk and optimize both R&D cycles and manufacturability.

Leadership Team

As of January 1, 2024, Jen Walls serves as the Chief Executive Officer (CEO) of Clas-SiC. Walls joined the company in July 2023 as Chief Operating Officer (COO) and has over 30 years of semiconductor industry experience, having held multiple technical, engineering, technology leadership, and management positions. She succeeded Rae Hyndman, a founding member of the business in 2017, who transitioned to a non-executive member of the board. The executive chairman is Carl Johnson, who has been instrumental in the company's formation and growth.

Leadership Changes

Effective January 1, 2024, Rae Hyndman transitioned from CEO to a non-executive member of the board, with Jen Walls assuming the role of CEO. This change reflects the company's strategic focus on growth and evolution in the SiC global market.

Competitor Profile

Market Insights and Dynamics

The silicon carbide (SiC) semiconductor market is experiencing significant growth, driven by the demand for more efficient energy conversion in industries such as automotive, rail, wind, photovoltaic (PV), and aviation. SiC technology enables smaller, lighter, and more energy-efficient power systems, making it a key enabler in the development of next-generation power electronics.

Competitor Analysis

Key competitors in the SiC semiconductor market include:

GlobalWafers Co., Ltd.: A Taiwanese semiconductor company and the world's third-largest silicon wafer supplier as of 2022. GlobalWafers operates multiple fabs worldwide, including a facility in Sherman, Texas, which opened in May 2025.

ON Semiconductor: A major player in the semiconductor industry, ON Semiconductor operates multiple fabs globally, including facilities in the United States, Czech Republic, and Japan. The company produces a wide range of semiconductor products, including SiC devices.

STMicroelectronics: A global semiconductor company with multiple fabs worldwide, including facilities in Singapore, France, and Italy. STMicroelectronics produces a variety of semiconductor products, including SiC devices.

Strategic Collaborations and Partnerships

In 2022, Clas-SiC signed a multi-million GBP Licensing, Royalty, and Consulting (LR&C) agreement with a Chinese-based integrated device manufacturer (IDM) to accelerate the IDM's silicon carbide design and manufacturing capabilities. In 2025, the company entered into another LR&C agreement to support the creation of a new SiC production facility in mainland Europe, resulting in the first in-country wide bandgap (WBG) wafer fabrication site in that region.

Operational Insights

Clas-SiC's strategic focus on rapid prototyping and low to medium-scale production capacity provides a time-to-market advantage for its customers. The company's extensive expertise in silicon carbide processing, combined with its proprietary Process Module IP, minimizes technical risk and optimizes both R&D cycles and manufacturability. These factors position Clas-SiC as a key player in the SiC semiconductor market, offering specialized services that complement the high-volume production capabilities of larger competitors.

Strategic Opportunities and Future Directions

Clas-SiC is exploring external investment opportunities to increase its capacity to 2.5 times existing levels. If successful, the company plans to undertake an 18-month investment plan of £20-£25 million in new capital expenditures and facility expansion, which would also increase employment by a further 25%. This expansion aligns with the growing demand for SiC devices in various industries and positions Clas-SiC to capitalize on emerging opportunities in the global semiconductor market.