eTopus Technology Company Profile

Background

eTopus Technology, founded in 2013, is a leading innovator in high-performance, DSP-based, mixed-signal, ultra-high-speed semiconductor interconnect solutions. The company's mission is to accelerate wired connections by delivering superior Bit Error Rate (BER) performance for long-reach applications at low power consumption, thereby enabling the next generation of cloud data centers with increased speed, capacity, and scalability. eTopus's ultra-high-speed SerDes IP is adopted by global Tier-1 players for use in networking, storage, 5G, and AI applications.

Key Strategic Focus

eTopus's strategic focus centers on developing advanced SerDes technology to meet the demands of high-performance computing and data center applications. The company's core objectives include:

Scalability: Supporting a wide data rate range from 1 to 112 Gbps and accommodating insertion loss ranges from 0 to 35 dB, ensuring adaptability across various applications.

Reliability: Delivering best-in-class performance for enterprise, cloud, and 5G infrastructure by equalizing any closed RX eyes and achieving superior pre- and post-FEC BER with minimal DFE error propagation.

Robustness: Ensuring minimal downtime for infrastructure through features like CDR maintaining lock even at 1% BER and excellent supply noise immunity.

Temperature Adaptability: Supporting a wide temperature range from -40°C to 125°C junction temperature, with fast adaptation tracking at 10°C per minute during temperature ramping.

Cost Efficiency: Enhancing customer competitiveness by minimizing system costs through dual power-rail designs and eliminating the need for external retimers.

Financials and Funding

eTopus has secured funding from leading venture capital firms, including SK Telecom Ventures and Hong Kong X-Tech. The company has raised a total of $6.9 million over multiple funding rounds, with the most recent being a Series B round in August 2024.

Pipeline Development

eTopus's product pipeline includes:

ePHY-5616: A high-performance SerDes solution operating at data rates from 1 to 56 Gbps, designed for enterprise, data center, and 5G applications.

ePHY-11207: A SerDes component achieving data rates up to 112 Gbps, tailored for ultra-high bandwidth and low-latency communication in advanced data center environments.

ePHY-5607: A versatile SerDes component operating at data rates between 1 to 56 Gbps, optimized for power, performance, and area in a 7nm process environment, suitable for modern data centers and AI applications.

Technological Platform and Innovation

eTopus's technological platform is distinguished by:

eTopus Partial-Response Technology (ePRT™) Architecture: A highly programmable and adaptive receiver DSP architecture compatible with existing standards, proven across multiple generations of silicon.

Proprietary Algorithms: Embedded DSP architecture developed with proprietary algorithms enabling rapid SerDes tuning and performance optimization.

Advanced DSP Techniques: Utilization of advanced DSP techniques for superior signal integrity and robustness, accommodating wide insertion loss ranges and ensuring reliable performance in challenging communication environments.

Leadership Team

Harry Chan: Co-Founder & Chief Executive Officer. Over 20 years of experience in engineering, operations, business development, sales, and marketing in Silicon Valley. Holder of 20 patents.

Peter Kou, Ph.D.: Co-Founder & Chief Technology Officer. Over 20 years of experience in systems architecture and digital signal processing. World-renowned expert in error control coding with landmark papers published in IEEE journals and conferences; approximately 50 patents granted or pending.

Danfeng Xu: Co-Founder & Vice President, Analog. Over 25 years of experience in developing analog mixed-signal and RF integrated circuit products for communications and storage applications. Published papers in IEEE conferences and journals, including the International Solid-State Circuits Conference; 10 patents granted or pending.

Shaohui Hsu: Chief Financial Officer (CPA). Over 25 years of finance and accounting experience with various management roles in companies ranging from startups to Fortune 500 companies. Broad knowledge in accounting and finance, including acquisition and integration, new business models, international accounting, and SOX compliance.

Competitor Profile

Market Insights and Dynamics:

The semiconductor interconnect solutions market is characterized by rapid technological advancements and increasing demand for high-speed data transmission, driven by the proliferation of data centers, cloud computing, 5G networks, and AI applications. Companies in this sector focus on developing innovative SerDes technologies to meet the growing need for faster and more reliable data communication.

Competitor Analysis:

Xilinx: Develops programmable devices and technologies, including high-speed SerDes solutions, catering to various applications such as data centers and telecommunications.

Blendics: Provides design methods and technology for integrated circuits, focusing on high-performance computing applications.

eHiway: Designs programmable chips and systems, specializing in high-speed data transmission solutions.

XILINX Japan: Specializes in adaptive computing and semiconductor solutions, including SerDes technologies for high-speed data communication.

Strategic Collaborations and Partnerships

eTopus has established significant collaborations to enhance its technological capabilities and market reach:

QuickLogic and OpenFive: Partnered to develop a collaborative IP platform for rapid and economical deployment of chiplets, including SerDes, eFPGA, Ethernet MAC/PCS, Die2Die, and RISC-V IPs.

Hirose Electric Co., Ltd.: Collaborated to develop a 112Gbps interconnect solution for AI training applications, combining eTopus's SerDes IP with Hirose's mezzanine connectors.

SiFive: Integrated SiFive's E2-Series RISC-V Core IP to power the receiver DSP control functions in eTopus's high-speed transceiver architecture.

Operational Insights

eTopus's strategic considerations include:

Market Position: Leveraging its innovative SerDes technology to establish a strong presence in the high-speed semiconductor interconnect solutions market.

Competitive Advantages: Offering scalable, reliable, and cost-efficient solutions with superior BER performance and low power consumption, differentiating itself from competitors.

Customer-Centric Approach: Working closely with partners to co-optimize designs to meet specific market needs, leveraging scalable system architecture and embedding cutting-edge DSP techniques to address the challenges of evolving digital communication landscapes.

Strategic Opportunities and Future Directions

eTopus's strategic roadmap includes:

Expansion into Chiplet Technology: Developing disaggregated, flexible eFPGA chiplet templates targeting advanced, high-performance applications, with availability expected in the first half of 2023.

Advancement in High-Speed Interconnects: Continuing to innovate in high-speed transceiver architectures to support a wide range of data rates and standards, enhancing system BER performance and CDR robustness while reducing system cost and power consumption.

Strengthening Partnerships: Building on existing collaborations and seeking new partnerships to enhance technological capabilities and expand market reach.