Company Research Report: SIEGERT WAFER GmbH
Company Overview
- Name: SIEGERT WAFER GmbH
- Mission: The company's mission is to provide the highest quality silicon wafers to meet customer requirements, utilizing its longstanding experience in the semiconductor industry.
- Founded: No information is available regarding the founding date or founders of the company.
- Key People: No information is available on the key people in the company.
- Headquarters: Charlottenburger Allee 7, 52068 Aachen, Germany
- Number of Employees: No information is available.
- Revenue: No information is available regarding the company's revenue.
- Known For: SIEGERT WAFER is known for supplying silicon wafers to universities, research laboratories, and the industry, leveraging their extensive experience in the semiconductor sector.
Products
1. Silicon Wafers
- Description: High-purity silicon wafers available in Czochralski (CZ) and Float-Zone (FZ) growth methods.
- Key Features:
- Diameter: 2" to 300 mm
- Grades: Prime, Test, Monitor, Dummy, Reclaim
- Growth Methods: CZ, FZ (HPS, NTD, GD)
- Type/Dopant: Boron, Phosphorus, Antimony, Arsenic, Undoped
- Orientation: <100>, <111>, <110>
- Resistivity: 0.001 - 50,000 Ohm-cm
- Thickness: 100 - 8,000 µm
- Surface Finish: Single and Double Side Polished, and others
2. Silicon Ingots
- Description: Available in various diameters and lengths, for specialized applications.
- Key Features:
- Diameter: 2" to 200 mm
- Material: Up to 11N purity silicon
- Growth Methods: CZ, FZ
- Type/Dopant: Similar to silicon wafers
3. Glass Wafers
- Description: Available up to 200 mm diameter and in various glass materials like Borofloat and Fused Silica.
- Key Features:
- Materials: Borofloat, Fused Silica, others
- Thickness: ≥200 µm
- Surface Finish: Double Side Polished
4. SOI Wafers
- Description: Customization available for small series production.
- Key Features:
- Diameter: 3" to 200 mm
- Device Layer Thickness: 380 nm - 100 µm
- BOX Layer: 100 nm - 10 µm
- Bonding Methods: Various advanced techniques
5. Sapphire Wafers
- Description: Wafers with fine surface finish for diverse applications.
- Key Features:
- Growth: Kyropolos, HEM
- Purity: ≥99.99%
- Diameter: 2" to 200 mm
6. Mask Blanks
- Description: Available with or without Anti-Reflection coatings.
- Key Features:
- Size: 3" x 3" to 6" x 6"
- Material: Soda Lime, Quartz
7. Other Materials
- Description: Wafers of III/V compounds such as GaAs, GaN, and Germanium are available.
- Key Features:
- Various diameters and orientations.
Recent Developments
- New Products Launched: No specific information on new product launches.
- New Features: SIEGERT WAFER offers an extensive portfolio of substrate materials and customizable specifications, adapting to market needs.
- Partnerships: The company coordinates processing steps by leveraging a network of specialized companies, providing comprehensive customer support.
- Certifications: The company is certified under ISO 9001:2015, affirming its commitment to quality.
Throughout its operations, SIEGERT WAFER GmbH emphasizes high precision and customization, underlining its dedication to meeting specific and evolving customer requirements in the semiconductor industry.
