Amol Kench
Education
University of Illinois Urbana-Champaign
Master of Business Administration - MBA, Business Administration and Management, General 2019-01-01 - 2021-01-01
University of Southern California
Master of Science - MS, Computer Engineering -
Savitribai Phule Pune University
Bachelor of Engineering - BE, Electronics and Telecommunications -Work Experience
MaxLinear
Current
MaxLinear
Samsung Semiconductor
2023-01-01 - 2024-01-01
Samsung Semiconductor
2022-01-01 - 2023-01-01
Qualcomm
1997-01-01 - 2022-01-01
Qualcomm
Siemens
1995-01-01 - 1997-01-01
Siemens
Skills
Summary
• Seasoned engineering leader with broad expertise in embedded product design, development, project management, integration and test. • Expertise in HW-SW integration and commercialization of complex ASIC/SoCs for data center, mobile, automotive, wearable, and IoT products. • Built and led international engineering teams, driving strategic project planning, and implementing innovative solutions integrated into billions of wireless devices worldwide. • Strong leadership, analytical, and communication skills • Led cross-departmental initiatives and fostered collaboration to deliver cutting-edge technology solutions. • Co-recipient of 5 granted US patents in the areas of wireless and location technology. • Excellent academic credentials with an MBA degree from UIUC and MS in Computer Engineering from USC. Core competencies include: Wireless technologies | Hardware-Software integration and product commercialization | Embedded software development | Low power measurement and optimization | SDLC | CI/CD | C/C++ | Perforce, Git, Jenkins | Technical Program Management | Agile methodologies | Scrum | JIRA, Confluence | Cross functional team leadership | Global team building and mentoring | Building trusting relationships | Innovation and process improvement | IP generation, US Patents | Dashboard and KPI management | Budget and resource allocation | MS-Office, Google Workspace |
